Director – Field Application Engineering, EMEA

Job Description

Join Axelera AI as the Director of Field Application Engineering for EMEA. This senior role involves being the primary technical contact for EMEA customers, from engineers to senior leadership. Lead hardware bring-up, board integration, and embedded system debugging on-site and remotely. Support chip-down design, custom carrier board development, and embedded Linux integration. Guide customers deploying AI models and inference pipelines via the Voyager SDK. Debug PCIe, power sequencing, signal integrity, thermal, and BSP bring-up issues. Drive pre-sales engagement and design wins across OEM/ODM, integrators, and end users across Europe. Build FAE processes, documentation, and support infrastructure for the EMEA region. Recruit, mentor, and manage EMEA FAE engineers as the team scales. Align priorities with commercial goals and contribute to EMEA and global FAE strategy. Act as the senior technical bridge between EMEA customer needs and global R&D and Product teams. Surface customer feedback and roadmap input to Product Management and R&D. Maintain relationships with key accounts, distributors, and channel partners across EMEA. Partner with Sales and BD on product introductions, onboarding, and competitive intelligence. Represent Axelera AI at EMEA industry events, conferences, and technical forums.

Qualifications

1. Master’s degree in Electrical Engineering, Computer Engineering, Embedded Systems, or related field 2. 10+ years customer-facing FAE or applications engineering in semiconductor, AI, or embedded systems 3. 5+ years leading FAE teams or managing technical customer-facing functions 4. Strong experience with embedded board design, chip-down development, and custom carrier board design 5. Experience with ARM-based SoCs and embedded compute modules 6. Experience with embedded AI or computer vision workloads 7. Strong understanding of high-speed digital interfaces, signal integrity, power sequencing, and thermal design 8. Experience with embedded Linux, bootloaders, BSPs, and low-level system bring-up 9. Proven ability to debug complex hardware/software integration issues 10. Familiarity with AI accelerators, NPUs, GPUs, or edge AI platforms 11. Commercial mindset; track record driving design wins through full evaluation and adoption cycles 12. Excellent English communication skills, as well as fluency in French and/or Italian 13. Ability to travel extensively across EMEA 14. Familiarity with Yocto, Buildroot, or Debian-based embedded Linux systems (preferred) 15. Experience with PCIe enumeration, MSI/MSI-X, DMA, and memory subsystems (preferred) 16. Experience with production validation, manufacturing bring-up, and thermal/power optimisation for AI systems (preferred) 17. Existing technical relationships in EMEA’s OEM/ODM, system integrator, or AI ecosystem (preferred) 18. Proficiency in additional EMEA languages (German, Arabic, Spanish) is a plus (preferred).

Benefits

- Shape and be part of a dynamic, fast-growing, international organization. Attractive compensation package, including a pension plan, extensive employee insurances and the option to get company shares. - An open culture that supports creativity and continual innovation. - Collaborative ownership and freedom with responsibility is characteristic for the way we act and work as a team.